Electronic components electronic accessories insulation material DMD chips

DMD chips composite material is made from high melting point polyester film and hot-rolling polyester fiber non-woven fabric. The polyester film and polyester non-woven fabric are bonded by B-class adhesive. DMD chips Features and Applications:
- Class B insulation (130°C)
- High mechanical strength, excellent electrical property, and immerse the function
- As slot , interphase and liner insulation for Y2 and other F-class electrical motorand electric apparatus.  DMD chips technical date:

NO.	Item	Unit	Normal value
1	Nominal thickness	mm	0.15	0.17	0.20	0.25	0.30	0.35
2	Nominal weight and tolerance	g/m2	140±20	190±28	225±33	300±45	350±52	425±63
3	Nominal thickness of film	um	50	75	100	150	190	250
4	TensileStengt MD no bending MD after bending TD no bending TD after bending	N/10mm	≥80 ≥80 ≥80 ≥70	≥120 ≥105 ≥105 ≥120	≥140 ≥120 ≥120 ≥100	≥190 ≥170 ≥170 ≥130	≥270 ≥200 ≥200 ≥150	≥320 ≥300 ≥300 ≥200
5	Elongation MD no bending MD after bending TD no bending TD after bending	%	≥15 ≥10 ≥20 ≥10	≥15 ≥10 ≥20 ≥10	≥15 ≥10 ≥20 ≥10	≥15 ≥10 ≥20 ≥10	≥5 ≥5	≥5 ≥5
6	Breakdown voltage Normal	KV	≥6	≥7	≥9	≥12	≥15	≥18
7	Bonding strength at room temperature	-	No delamination
8	Bonding strength at 155±2°C for 10 min	-	No delamination,blister and drainage

     
                                                                                  For more information of  DMD chips, Please contact with Ms Jenny.